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Ball grid array
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61	Cyclone V Device Overview Add to Reading List Source URL: www.altera.com Language: English - Date: 2014-07-07 02:20:35 Computer buses Integrated circuits Altera Field-programmable gate array Ball grid array General Purpose Input/Output Joint Test Action Group PCI Express Secure Digital Electronic engineering Electronics Computer hardware
62	Brokerage H2020 Call ICT2 – 2014 Partner Presentation: NANIUM S.A[removed]Partner and contact person: NANIUM S.A., Vila do Conde, Porto, Portugal Steffen Kröhnert, Director of Technology Expertise and Activities: Add to Reading List Source URL: ec.europa.eu Language: English - Date: 2014-03-10 05:00:00 Technology Embedded Wafer Level Ball Grid Array Three-dimensional integrated circuit Qimonda Integrated circuit packaging Wafer-level packaging Semiconductor device fabrication Electronics Microtechnology
63	United States Court of Appeals for the Federal Circuit __________________________ SPANSION, INC. AND SPANSION, LLC, Appellants, AND Add to Reading List Source URL: www.cafc.uscourts.gov Language: English - Date: 2010-12-21 10:56:12 Electronics manufacturing Semiconductor devices Semiconductors Electronic design Semiconductor device fabrication Ball grid array Printed circuit board Semiconductor package Solder Electronic engineering Electronics Electromagnetism
64	Advanced Lead Frame Services— From Design to Delivery ® QPL Add to Reading List Source URL: www.qpl.com Language: English - Date: 2014-01-22 22:33:49 Semiconductor device fabrication Quad-flat no-leads package Electronics manufacturing Quad Flat Package Integrated circuit packaging Dual in-line package Small-outline integrated circuit Printed circuit board Ball grid array Electronics Electronic engineering Microtechnology
65	Gesellschaft für Mikrotechnologie mbH www.microTEC-D.com White Paper: Reliability of RMPD® and 3D-CSP based packaging solutions Add to Reading List Source URL: www.microtec-d.com Language: English - Date: 2013-04-05 08:47:21 Semiconductor device fabrication Electronic design Semiconductor devices Industrial design Industrial engineering Packaging and labeling Ball grid array Reliability Light-emitting diode Technology Electronic engineering Electronics
66	UM10114 LPC21xx and LPC22xx User manual Rev. 03 — 2 April 2008 Add to Reading List Source URL: embedded.ifmo.ru Language: English - Date: 2009-08-10 09:36:25 Microcontrollers I²C Ball grid array Computer hardware Comparison of 802.15.4 radio modules Quad Flat Package Electronics Electronic engineering
67	Application Note AN-1170 Audio Power Quad Flat No-Lead (PQFN) Add to Reading List Source URL: www.irf.com Language: English - Date: 2014-03-03 06:06:17 Electromagnetism Solder paste Surface-mount technology Rework Reflow soldering Desoldering Ball grid array Quad-flat no-leads package Solder Electronics manufacturing Electronics Manufacturing
68	Microsoft Word - AN-1133_Rev_C.doc Add to Reading List Source URL: www.irf.com Language: English - Date: 2010-05-31 11:57:10 Manufacturing Quad-flat no-leads package Surface-mount technology Ball grid array Rework Solder Restriction of Hazardous Substances Directive Reflow soldering Printed circuit board Electronics manufacturing Electronics Electromagnetism
69	MEMORY BURN-IN SOCKETS A Network of Burn-in Solutions Add to Reading List Source URL: www.sensata.com Language: English - Date: 2010-10-26 13:17:54
70	INTERCONNECTION BUSINESS A Network of Burn-In Solutions Automotive Broadband DSP Add to Reading List Source URL: www.sensata.com Language: English - Date: 2012-10-13 16:17:22 Electronics Zero insertion force Socket F Socket S1 Socket 478 Printed circuit board Surface-mount technology Ball grid array CPU sockets Electronic engineering Electromagnetism

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